Molded leadframe substrate semiconductor package

摘要

A process for forming an optical package comprises at least partially encasing a first leadframe strip in a first mold compound thereby forming a molded leadframe strip, mounting at least one optical semiconductor device on the molded leadframe strip, at least partially encasing the molded leadframe strip, and singulating the molded leadframe strip to form discrete packages for optical applications. An apparatus for forming an optical package comprises means for at least partially encasing a first leadframe strip in a first mold compound thereby forming a molded leadframe strip, means for mounting at least one optical semiconductor device on the at least one molded leadframe strip, means for at least partially encasing the molded leadframe strip, and means for singulating the molded leadframe strip to form discrete and grid array packages.

主权项

1. A process of forming a semiconductor package for optical applications, the process comprising:
placing a first leadframe strip in a mold cavity that is defined by a top mold and a bottom mold, wherein the bottom mold includes a tape loader to provide tape that has pre-formed holes configured to receive protrusions on a surface of the bottom mold; at least partially encasing the first leadframe strip in a first mold compound thereby forming a molded leadframe strip, wherein the molded leadframe strip includes a first planar surface and a second planar surface that is lower than the first planar surface; mounting at least one optical semiconductor device on the molded leadframe strip between a first portion of the second planar surface and a second portion of the second planar surface; mounting bondwires on the at least one optical semiconductor device to effectuate electrical contact between the at least one optical semiconductor device and the second planar surface; mounting at least one cap on the molded leadframe strip, wherein each of the at least one cap includes a lateral surface forming an opening at an underside of the at least one cap, wherein the lateral surface is perpendicular and affixed to the first planar surface; at least partially encasing the molded leadframe strip and the at least one cap in a second mold compound such that the second mold compound is on the first planar surface and abuts an exterior portion of the lateral surface; and singulating the molded leadframe strip to form discrete packages for optical applications.