发明名称 METHOD FOR FORMING COPPER CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a copper circuit, which dispenses with an etching resist, high-precision printing equipment and the like, and which enables a wiring pattern to be simply drawn with a high degree of repetition accuracy through a small number of steps.SOLUTION: A method for forming a copper circuit includes: an application step of applying a copper film forming agent, which contains a copper complex for forming the copper film, onto a base material; a photoirradiation step of forming the copper film by irradiating a predetermined part of the applied copper film forming agent with light; and a cleaning step of cleaning and removing a part that is not irradiated with the light.
申请公布号 JP2015128094(A) 申请公布日期 2015.07.09
申请号 JP20130272718 申请日期 2013.12.27
申请人 SHIKOKU CHEM CORP 发明人 IIDA SOSAKU
分类号 H05K3/10;G03F7/004;G03F7/32;H05K3/02 主分类号 H05K3/10
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