PHOSPHOR ENCAPSULATION TYPE LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION DEVICE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to a phosphor encapsulation type light emitting device package applied to a lighting or display device, a backlight unit, the lighting device, and a method for manufacturing the phosphor encapsulation type light emitting device package. The phosphor encapsulation type light emitting device package includes a light emitting element, a lead which is electrically connected to the light emitting element, and a phosphor which surrounds the lead and the light emitting element. The lead includes a first lead and a second lead which is installed with a separation space with the first lead. The first lead and the second lead are firstly bent to form a light emitting element receiving space inside. The phosphor has a space to integrally surround the lead and the light emitting element which is electrically connected to the lead and is received in the light emitting element receiving space.