| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique capable of efficiently processing a substrate having a recess on the surface thereof.SOLUTION: A substrate processing method for processing a substrate 9 having a recess on the surface thereof comprises the steps of: a) forming a liquid film of the process liquid covering a surface of the substrate 9 held in a horizontal posture and rotated in a horizontal plane by supplying the process liquid to the surface of the substrate; and b) switching the rotation speed of the substrate 9 twice or more between a first rotation speed and a second rotation speed while keeping the liquid film of the process liquid covering the surface of the substrate 9. However, the step a) and the step b) are performed in parallel.</p> |
