| 发明名称 |
THERMOSETTING RESIN COMPOSITION AND USAGE THEREOF |
| 摘要 |
The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level. |
| 申请公布号 |
US2015189744(A1) |
申请公布日期 |
2015.07.02 |
| 申请号 |
US201414580321 |
申请日期 |
2014.12.23 |
| 申请人 |
Shengyi Technology Co., Ltd. |
发明人 |
ZENG Xianping;REN Nana |
| 分类号 |
H05K1/03;C08L85/02;H01B1/02;C08L63/00 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermosetting resin composition comprising of:
(A) epoxy resin; (B) active ester curing agent; (C) polyphosphonate ester or/and phosphonate-carbonate copolymer. |
| 地址 |
Guangdong CN |
