MATERIAL FOR BONDING ELECTRONIC COMPONENT, AND METHOD FOR BONDING ELECTRONIC COMPONENT

摘要

The purpose of the present invention is to provide a material for bonding an electronic component, such as an electroconductive paste or electroconductive film provided with each of reworkability, storage stability, heat resistance, etc., and to provide a highly reliable electronic device in which the material for bonding an electronic component is used. A material for bonding is used which contains 20-100 parts by mass of core-shell-type organic particles and 0.1-100 parts by mass of electroconductive particles with respect to 100 parts by mass of epoxy resin, the material for bonding containing at least 45 parts by mass of a phenoxy-type epoxy resin having a glass transition temperature of 100°C or higher in 100 parts by mass of the epoxy resin.