| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an interpenetrating polymer network (IPN) adhesive that can reduce or eliminate residual stresses generated in composites by differential expansion of components forming the composites in bonding composite structures.SOLUTION: An adhesive comprises a composition that consists essentially of a first polymer system and a second polymer system. The first polymer system has a first modulus of about 180 ksi to 335 ksi. The first polymer system consists essentially of a thermosetting acrylate. The second polymer system consists essentially of a thermosetting epoxy system and an epoxy curing agent. The thermosetting epoxy system comprises a first epoxy.</p> |
