DOUBLE GOLD PLATING METHOD AND ELECTRONIC COMPONENT

摘要

Provided are: a low-cost gold plating method having excellent anticorrosion properties; and an electronic component which is produced using this gold plating method. In this double gold plating method, a base gold plating layer (2) is formed on the surface of a material to be plated (1) in a first plating process, and then a finishing gold plating layer (5) is formed on the surface of the base gold plating layer (2) by having gold crystals finer than those during the formation of the base gold plating layer (2) precipitate on the surface of the base gold plating layer (2) in a second plating process.