发明名称 |
MICRO-CHANNEL HEAT SINK FOR LED HEADLAMP |
摘要 |
The present application discloses various embodiments of a heat sink for semiconductor devices and methods for using and constructing the same. According to at least one aspect of the present disclosure, a heat sink for cooling a semiconductor device includes a base plate including a first side and a second side; a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate and opposing walls extending between the base plate and the distal end; a leg plate disposed adjacent the distal end of the leg; a plurality of fins disposed between the distal end of the leg and the leg plate; and a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate. |
申请公布号 |
EP2888528(A2) |
申请公布日期 |
2015.07.01 |
申请号 |
EP20130831224 |
申请日期 |
2013.08.22 |
申请人 |
FLEX-N-GATE ADVANCED PRODUCT DEVELOPMENT, LLC |
发明人 |
HAMID, MUHAMMED, AQIL;BARMAN, STEVE;SCHWEITZER, CHARLES, F. |
分类号 |
H01L33/64;F21V29/60;F21V29/71;F21V29/74;F21V29/76;F21V29/83 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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