| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition that has initial adhesion, can bind metals together, the metal and an organic material together, and the organic materials together, and can keep its transparency after thermal curing. <P>SOLUTION: The adhesive composition comprises at least: a bisphenol A-type epoxy resin and a bisphenol A-type phenoxy resin, as a resin component; a hydrazide-based curing agent as a curing agent; and xylylene diisocyanate as a crosslinking agent. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
