Thermosetting resin composition, cured product thereof, and printed wiring board using the same

摘要

Provided are: a thermosetting resin composition in which a cured product is excellent in low warp properties, thermal cycle characteristics, and the like, and occurrence of cracking of a coating film in a B-stage state is suppressed; a cured product thereof; and a printed wiring board in which the cured product is used. The thermosetting resin composition comprises: (A) an epoxy resin; (B) a curing agent for an epoxy resin; (C) spherical silicon dioxide and/or spherical aluminum oxide; and (D) a block copolymer.

主权项

1. A thermosetting resin composition, comprising:
an epoxy resin; a curing agent for the epoxy resin; spherical silicon dioxide and/or spherical aluminum oxide; and a block copolymer, wherein the block copolymer has a weight average molecular weight, Mw, of 50000 or more and 300000 or less and a molecular weight distribution, Mw/Mn, of 3 or less, and the spherical silicon dioxide and/or spherical aluminum oxide are included in an amount of 50 wt % or more based on a total thermosetting resin composition.