GAS SENSOR PACKAGE

摘要

According to an embodiment of the present invention, a gas sensor package comprises: a read frame; a readout integrated circuit device buried in the read frame; a gas sensor attached to one side of the readout integrated circuit device; a MEMS cap having an internal space for accepting the gas sensor to be attached to one side of the readout integrated circuit device; and a mold part to cover the read frame, the readout integrated circuit device, and the MEMS cap, wherein the top of the MEMS cap can be formed on the same plane as the top of the mold part.