CIRCUIT BOARD ASSEMBLY CONFIGURATION

摘要

A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules.

主权项

1. A printed circuit board (PCB) rack unit configuration comprising:
a first PCB assembly including a plurality of memory interfaces for dual-inline memory modules (DIMMs), the first PCB assembly having a first side and a second side coupled to a first socket; and a second PCB assembly including a plurality of memory interfaces for DIMMs, the second PCB assembly having a first side and a second side coupled to a second socket, wherein an orientation of said second PCB assembly is inverted with respect to an orientation of said first PCB assembly wherein said first side of said first PCB assembly faces said first side of said second PCB assembly, and wherein further said first PCB assembly and said second PCB assembly are arranged with mechanical clearance with respect to each other.