| 发明名称 |
SEMICONDUCTOR SYSTEM AND POWER SOURCE CHIP |
| 摘要 |
A semiconductor system includes a semiconductor package having first and second semiconductor chips and a controller configured to control the first and second semiconductor chips, and a power source chip that is connected to a control line of the semiconductor package, and is configured to supply to the first and second semiconductor chips and the controller, power having different voltage or current levels that correspond to a voltage level of the control line. |
| 申请公布号 |
US2015179234(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414276765 |
申请日期 |
2014.05.13 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KAWASE Masayasu;EGUCHI Toyokazu |
| 分类号 |
G11C5/14;G05F5/00;G11C14/00 |
主分类号 |
G11C5/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor system comprising:
a semiconductor package having first and second semiconductor chips and a controller configured to control the first and second semiconductor chips; and a power source chip that is connected to a control line of the semiconductor package, and is configured to supply, to the first and second semiconductor chips and the controller, power having a level that correspond to a voltage level of the control line. |
| 地址 |
Tokyo JP |
