发明名称 CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle capable of making initial connection resistance low when a connection structure is obtained by electrically connecting electrodes by the conductive particle, and capable of maintaining connection resistance low even when the connection structure is exposed in a presence of acid. ! SOLUTION: The conductive particle 1 has a substrate particle 11, a first conductive layer 12 arranged on a surface of the substrate particle 11 and formed from silver or copper and a second conducive layer 13 arranged on an outside surface of the first conductive layer 12 and formed from nickel, the second conductive layer 13 contains nickel, boron, tungsten or molybdenum. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015118933(A) 申请公布日期 2015.06.25
申请号 JP20140233611 申请日期 2014.11.18
申请人 SEKISUI CHEM CO LTD 发明人 O GYOKA
分类号 H01B5/00;C22C19/03;C22C19/05;H01B1/00;H01B1/22;H01R11/01 主分类号 H01B5/00
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