| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning method arranged so that an undesired small-particle size substance attached to a substrate can be removed without affecting the surface of a substrate. ! SOLUTION: A substrate cleaning method according to an embodiment of the present invention comprises: a film-forming process liquid supplying step; a stripping process liquid supplying step; and a dissolving process liquid supplying step. In the film-forming process liquid supplying step, a film-forming process liquid including a volatile component and used for forming a film on a substrate is supplied onto the substrate. In the stripping process liquid supplying step, a stripping process liquid for stripping, from the substrate, a process film formed by volatilizing the volatile component and consequently solidifying or curing the film-forming process liquid on the substrate is supplied to the process film. In the dissolving process liquid supplying step, a dissolving process liquid for dissolving the |
