| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of a detector head which is easily manufactured, reliable, and capable of mounting a large-area semiconductor detector chip.SOLUTION: The detector head structure of a semiconductor radiation detector includes: a detector chip 401 that has a front surface side and a rear surface side; and a support plate 402 that is arranged on the rear surface side of the detector chip 401 and has electrical connection with the detector chip 401. A base plate 403 includes: a thermoelectric cooler 404 that is mounted on the base plate 403; and a contact pin 405 that protrudes from the base plate 403 toward the detector chip 401. An adhesive plate 406 is on a side opposite to the base plate of the thermoelectric cooler 404, and a first wire bond connection 407 passes between the contact pin 405 and adhesive plate 406. A joint plate 408 is between the adhesive plate 406 and support plate 402, and electrical connection between the support plate 402 and adhesive plate 406 is performed via the joint plate 408. |
