| 发明名称 |
MECHANISM FOR FORMING MEMS DEVICE |
| 摘要 |
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element. |
| 申请公布号 |
US2015158716(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201314098974 |
申请日期 |
2013.12.06 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd |
发明人 |
CHENG Shyh-Wei;WENG Jui-Chun;HSU Hsi-Cheng;WANG Chih-Yu;KO Chuan-Yi;CHIANG Ji-Hong;HUNG Chung-Hsien;CHEN Hsin-Yu;CHEN Chih-Hsien;WU Yu-Mei;CHEN Jong |
| 分类号 |
B81B3/00;B81C1/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A micro-electro mechanical system (MEMS) device, comprising:
a substrate; a MEMS substrate disposed on the substrate, wherein the MEMS substrate comprises a movable element, a fixed element and at least a spring connected to the movable element and the fixed element; and a polysilicon layer formed on the movable element, wherein the polysilicon layer covers a portion of the movable element and is between the movable element and a fixed surface so as to prevent the movable element from being adhered to the fixed surface. |
| 地址 |
Hsin-Chu TW |
