| 摘要 |
<p>Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt% to about 0.8 wt%, Pd in a range from about 0.001 wt% to about 0.1 wt%, Al in a range from about 0.001 wt% to about 0.1 wt%, Si in a range from about 0.001 wt% to about 0.1 wt%, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.</p> |
| 申请人 |
MK ELECTRON CO., LTD.;HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION;KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY;KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY;KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
HONG, SUNG JAE;KIM, KEUN SOO;LEE, CHANG WOO;BANG, JUNG HWAN;KO, YONG HO;LEE, HYUCK MO;CHANG, JAE WON;KOO, JA HYUN;MOON, JEONG TAK;LEE, YOUNG WOO;HONG, WON SIK;KIM, HUI JOONG;LEE, JAE HONG |
