发明名称 WIRING BOARD CONNECTION METHOD AND WIRING BOARD MOUNTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board connection method and a wiring board mounting structure which have high connection reliability. ! SOLUTION: A wiring board connection method comprises: a first step of arranging on a mounting surface, a wiring board which has a first terminal provided on a first surface, a second terminal provided on a second surface on the side opposite to the first surface and a via hole for connecting the first terminal and the second terminal; a step of positioning a tool having a recess in a relationship such that the recess overlaps the via hole and the wiring board outside the via hole and subsequently contacting the tool with the wiring board; a step of melting a solder material in a state where the tool contacts the wiring board and causing the solder material to enter into the via hole and the recess of the tool; and a step of solidifying the solder material to connect the wiring board to the mounting surface. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015106663(A) 申请公布日期 2015.06.08
申请号 JP20130248597 申请日期 2013.11.29
申请人 SUMITOMO ELECTRIC DEVICE INNOVATIONS INC 发明人 ONO HARUYOSHI
分类号 H05K3/36;H05K1/14 主分类号 H05K3/36
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