| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method and a device, without hitching a cut piece in a hole, when processing a small hole in a work by laser processing.SOLUTION: The laser processing method for drilling a hole in a plate-like work, controls operation of a laser processing head according to a cut piece dropping program pre-programmed with a relative moving passage of the laer processing head to a processing hole 1 and an injection condition of assist gas in the moving passage, for dropping a cut piece 7 in the processing hole 1 after executing hole drilling by laser processing according to a pre-prepared hole drilling program. |
