发明名称 |
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and an electronic component mounting circuit board.SOLUTION: An electronic component includes: a base material part; a coil part which is provided on the base material part and includes a coil formed by a conductive pattern being spirally disposed and an external terminal connected with an end part of the coil; and a cover part including an external electrode including a first surface contacting with an upper part surface of the external terminal and a second surface that is an opposite surface of the first surface, the cover part further including a magnetic material part which is provided on the coil part, is made of a magnetic material, and exposes the second surface. An area of the first surface is formed larger than an area of the second surface. |
申请公布号 |
JP2015103817(A) |
申请公布日期 |
2015.06.04 |
申请号 |
JP20140238658 |
申请日期 |
2014.11.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
CHANG GEON SE;KWON YONG-DO;YANG JIN HYUCK |
分类号 |
H01F27/29;H01F17/00;H01F17/04;H01F27/06 |
主分类号 |
H01F27/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|