发明名称 ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component and an electronic component mounting circuit board.SOLUTION: An electronic component includes: a base material part; a coil part which is provided on the base material part and includes a coil formed by a conductive pattern being spirally disposed and an external terminal connected with an end part of the coil; and a cover part including an external electrode including a first surface contacting with an upper part surface of the external terminal and a second surface that is an opposite surface of the first surface, the cover part further including a magnetic material part which is provided on the coil part, is made of a magnetic material, and exposes the second surface. An area of the first surface is formed larger than an area of the second surface.
申请公布号 JP2015103817(A) 申请公布日期 2015.06.04
申请号 JP20140238658 申请日期 2014.11.26
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHANG GEON SE;KWON YONG-DO;YANG JIN HYUCK
分类号 H01F27/29;H01F17/00;H01F17/04;H01F27/06 主分类号 H01F27/29
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