| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device with a light-emitting diode element, capable of improving yield in a manufacturing process.SOLUTION: The light-emitting device 1 includes: a substrate 10 having a groove 13 surrounding a die bond region 12 positioned on an upper surface 11; a light-emitting diode element 20 positioned on the die bond region 12; electrode elements 30, 40 electrically connected with the die bond region 12 and an external power source; and a seal ring 50 embedded into a part of a groove 13 and retaining grooves 33, 34, 43, 44 and provided so that the electrode elements 30, 40 are retained in the groove 13. |
