SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING DEVICE

摘要

A multi-chip module (10) comprising the following: a silicon interposer (6) that supports a processor IC (1); glass interposers (5) that support optical ICs (2); a ceramic substrate (3) that supports the silicon interposer (6) and the glass interposers (5); and a plurality of solder balls (8) provided on said ceramic substrate (3). The silicon interposer (6) and the glass interposers (5) are intermingled, and the processor IC (1) is mounted so as to straddle the silicon interposer (6) and the glass interposers (5).