| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation effect.SOLUTION: A motor pump 10 includes a circuit board 60 separated from a flow path 102 by a housing 12 and separated from the outside of the motor pump 10 by a board cover part 74. A contact rib 82 of the housing 12 is in contact with a heater element 62 of the circuit board 60 through a first heat-conductive adhesive 90, and the board cover part 74 is in contact with the top surface (via hole 64) of the circuit board 60 through a second heat-conductive adhesive 92. Thereby, heat generated by the heater element 62 is transmitted to cooling water W inside the flow path 102 through the first heat-conductive adhesive 90 and the housing 12, and is transmitted to air outside the motor pump 10 through the via hole 64, the second heat-conductive adhesive 92, and the board cover part 74. That is, the heat generated by the heater element 62 can be released from both sides in the plate thickness direction of the circuit board 60, which can implement a convection structure using a flow of the cooling water W inside the flow path 102. |
