MICROSTRIP PATCH ANTENNA WITH CAVITY-BACKED STRUCTURE INCLUDING VIA-HOLE

摘要

The present invention discloses a microstrip patch antenna, which comprises a via-hole pad forming a cavity-back structure with a plurality of via-holes; a patch located on the via-hole pad; one or more feeding via-holes located on one side of the patch to penetrate the patch and the via-hole pad; and a shortening via-hole located on the other side of the patch to connect the patch with a ground unit.