| 发明名称 |
DIELECTRIC MATERIALS |
| 摘要 |
Certain polyphenylene oligomers having good solvent strip resistance, low coefficient of thermal expansion and good adhesion to a variety of surfaces are useful as thin-film dielectric materials in electronics applications. |
| 申请公布号 |
US2015147463(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414552513 |
申请日期 |
2014.11.25 |
| 申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
Gilmore Christopher D.;BU Lujia;CHUANG Peng-Wei;KIARIE Cecilia Waithera;KIM Young Seok;O'Connell Kathleen M.;CAPORALE Stefan J. |
| 分类号 |
C09D171/00;H01B19/04;C08G65/00 |
主分类号 |
C09D171/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An oligomer comprising as polymerized units a first monomer comprising two cyclopentadienone moieties and a second monomer having the formulawherein a is the number of R groups and is an integer from 0 to 4; each R is independently chosen from (C1-C4)alkyl, halo(C1-C4)alkyl, (C1-C4)alkoxy, (C i-C4)aralkyl, (C6-C10)aryl, or substituted (C6-C10)aryl; wherein the first monomer and the second monomer are present in a mole ratio of from 1:1.001 to 1:1.95; and wherein the oligomer comprises terminal ethynyl moieties. |
| 地址 |
Marlborough MA US |
