Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

摘要

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

主权项

1. An apparatus comprising:
a substrate build-up film, wherein the build-up film comprises: an epoxy material; and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured and an exterior formed from the same material as the interior, is more cured than the interior.