Semiconductor including cup-shaped leadframe packaging techniques

摘要

A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

主权项

1. A method of fabricating a semiconductor package comprising electrically coupling a first side of a die to a first portion of a cup shaped lead frame such that a surface of a second portion of the cup shaped lead frame along two edges of the die is coplanar with a second side of the die but not electrically coupled to a terminal of the second side of the die and the second portion of the cup shaper lead frame along the other two edges of the die is not coplanar with a second side of the die, wherein the first side of the die is oppositely disposed from the second side of the die, and wherein the second portion of the cup shaped lead frame includes a plurality of individual leads along each of the two edges of the die.