| 摘要 |
Technologies are generally described for fabricating a multilayer substrate for a flexible electronic device. In example methods, at least one flexible film layer may be attached to a support film layer. At least one pattern may be formed on the at least one flexible film layer. The support film layer may be detached from the at least one flexible film layer. The support film layer may include a material with greater rigidity and lower thermal expansion coefficient than the at least one flexible film layer. The at least one flexible film layer may be attached to the support film layer using an adhesive such as a UV-curing adhesive. Further, the support film layer may be detached from the at least one flexible film layer by irradiating the UV-curing adhesive with ultraviolet light. The at least one flexible film may be attached to the support film layer using a roll-to-roll process. |
