| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite board which prevents warpage from occurring on a printed wiring board during reflow for mounting electronic components.SOLUTION: A composite board 100 includes: multiple printed wiring boards 10; and multiple metal frames 30Ga to 30Gd, each of which includes an opening 30 for individually housing the printed wiring board 10. Since the metal frames 30Ga to 30Gd positioned by pin sheet 31 are connected with each other through an adhesive 40, variation of warpage which results from differences of positions of the printed wiring boards 10 in the composite board 100 is inhibited. |
