HEAT DISSIPATION ASSEMBLY

摘要

A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.

主权项

1. An assembly for dissipating heat in an electronic circuit, the assembly comprising:
a heat spreader having a high thermal conductivity for connecting to the circuit; a substrate connected to the heat spreader on a first side of the substrate; a heat slug having a high thermal conductivity and being connected to the heat spreader on a first side of the heat slug and adjacent to the substrate; and a backplate having a high thermal conductivity and being connected to the substrate on a second side of the substrate opposite its first side and connected to the heat slug on a second side of the heat slug opposite its first side, the heat spreader, the substrate, and the backplate forming a layered stack of materials with a highly thermally conductive path for cooling the circuit, the heat spreader having a coefficient of thermal expansion (CTE) matching a CTE of the circuit and the substrate having a CTE matching a CTE of the backplate.