| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that: an insulation film disposed between adjacent pixels, which is also called a bank, a partition wall, a barrier wall, an embankment, or the like is provided over a source wiring of a thin film transistor, a drain wiring of the thin film transistor, or a power supply line; an intersection part of these two types of the wirings, especially provided on different layers, has a step larger than other parts; and even in a case where the insulation film provided between the adjacent pixels is formed by a coating method, some areas are formed thinly due to influence of this step and withstand voltage at this area is lowered.SOLUTION: In the vicinity of a convex part with a large step, particularly in the vicinity of a wiring intersection part, a dummy member is disposed to ease an unevenness shape of an insulation film formed thereon. An upper wiring and a lower wiring are formed displaced from each other so that an end of the upper wiring and an end of the lower wiring do not correspond to each other. |
