| 摘要 |
<p>Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux; dispensing a thermosetting resin to at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon, to melt the bumps and cure the thermosetting resin, followed by cooling, thereby to join the first electronic component to the substrate.</p> |
