| 摘要 |
A light emitting device according to the embodiment of the present invention includes a light emitting structure which includes a first conductive semiconductor layer, an active layer which is arranged under the first conductive semiconductor layer, and a second conductive semiconductor layer which is arranged under the active layer, a sub mount which includes a first metal pad and a second metal pad which are horizontally separated on the upper side thereof, a first current bump part which is arranged between the first conductive semiconductor layer and the first metal pad, a second current bump part which is arranged between the second conductive semiconductor layer and the second metal pad, and at least one heat bump part which is arranged between the sub mount and the first or second conductive semiconductor layer. |
