Airgap-containing interconnect structure with patternable low-k material and method of fabricating

摘要

An interconnect structure is provided that includes at least one patterned and cured low-k dielectric material located on a surface of a patterned inorganic antireflective coating that is located atop a substrate. The inorganic antireflective coating comprises atoms of M, C and H wherein M is at least one of Si, Ge, B, Sn, Fe, Ta, Ti, Ni, Hf and La. The at least one cured and patterned low-k dielectric material and the patterned inorganic antireflective coating have conductively filled regions embedded therein and the at least one cured and patterned low-k dielectric material has at least one airgap located adjacent, but not directly in contact with the conductively filled regions.

主权项

1. An interconnect structure comprising:
at least one patterned and cured low-k dielectric material located on an upper surface of a patterned inorganic antireflective coating that is located atop a substrate, wherein said inorganic antireflective coating comprises atoms of M, C and H wherein M is at least one of Si, Ge, B, Sn, Fe, Ta, Ti, Ni, Hf and La, said at least one cured and patterned low-k dielectric material and said patterned inorganic antireflective coating having conductively filled regions embedded therein and said at least one cured and patterned low-k dielectric material having at least one airgap located adjacent, but separated from the conductively filled regions by a portion of said low-k dielectric material.