| 发明名称 | Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member | ||
| 摘要 | A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation. | ||
| 申请公布号 | US9037063(B2) | 申请公布日期 | 2015.05.19 |
| 申请号 | US201313930624 | 申请日期 | 2013.06.28 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Lee Sang-eui;Kim Ha-jin;Kim Dong-earn;Kim Dong-ouk;Park Sung-hoon;Bae Min-jong;Son Yoon-chul;Chu Kun-mo |
| 分类号 | G03G15/20;H01C17/02;H01C17/06;H05B3/46;H05B3/14;H05B3/00;B82Y30/00;H01C17/065 | 主分类号 | G03G15/20 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A method of forming thin film resistive heating layer, the method comprising: providing a polymer layer by extruding a polymer paste, in which an electroconductive filler is dispersed, using an extrusion molding operation on an outer circumferential surface of a cylindrical member; and providing a thin film resistive heating layer using a ring blading operation such that an outer diameter of the polymer layer is substantially uniform. | ||
| 地址 | Gyeonggi-do KR | ||