发明名称 REFRIGERATION APPARATUS
摘要 In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.
申请公布号 US2015128631(A1) 申请公布日期 2015.05.14
申请号 US201314395425 申请日期 2013.04.08
申请人 DAIKIN INDUSTRIES, LTD. 发明人 Oguri Akihiko;Teraki Junichi;Kita Masanobu;Doumae Hiroshi;Ikeda Motonobu;Fujiwara Masahide
分类号 F25D23/00 主分类号 F25D23/00
代理机构 代理人
主权项 1. A refrigeration apparatus having a refrigerant circuit, comprising: a heavy electric component group including a power device; a light electric component group; a printed wiring board, on one main surface of which the heavy electric component group and the light electric component group are mounted, the printed wiring board being disposed in a vertical direction; a refrigerant pipe through which a refrigerant of the refrigerant circuit flows; and a refrigerant jacket cooling the power device by a refrigerant flowing in a cooling portion which is one portion of a liquid pipe of the refrigerant pipe, wherein the main surface of the printed wiring board includes: a heavy electric region which is a region in a lower part of the printed wiring board where the heavy electric component group is disposed; and a light electric region which is a region situated above the heavy electric region, where the light electric component group is disposed, and wherein the refrigerant jacket contacts the power device arranged in the heavy electric region; and the liquid pipe of the refrigerant pipe includes a portion extending upwards towards the refrigerant jacket, and the cooling portion contacts the refrigerant jacket.
地址 Osaka-shi, Osaka JP