发明名称 |
REFRIGERATION APPARATUS |
摘要 |
In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket. |
申请公布号 |
US2015128631(A1) |
申请公布日期 |
2015.05.14 |
申请号 |
US201314395425 |
申请日期 |
2013.04.08 |
申请人 |
DAIKIN INDUSTRIES, LTD. |
发明人 |
Oguri Akihiko;Teraki Junichi;Kita Masanobu;Doumae Hiroshi;Ikeda Motonobu;Fujiwara Masahide |
分类号 |
F25D23/00 |
主分类号 |
F25D23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A refrigeration apparatus having a refrigerant circuit, comprising:
a heavy electric component group including a power device; a light electric component group; a printed wiring board, on one main surface of which the heavy electric component group and the light electric component group are mounted, the printed wiring board being disposed in a vertical direction; a refrigerant pipe through which a refrigerant of the refrigerant circuit flows; and a refrigerant jacket cooling the power device by a refrigerant flowing in a cooling portion which is one portion of a liquid pipe of the refrigerant pipe, wherein the main surface of the printed wiring board includes: a heavy electric region which is a region in a lower part of the printed wiring board where the heavy electric component group is disposed; and a light electric region which is a region situated above the heavy electric region, where the light electric component group is disposed, and wherein the refrigerant jacket contacts the power device arranged in the heavy electric region; and the liquid pipe of the refrigerant pipe includes a portion extending upwards towards the refrigerant jacket, and the cooling portion contacts the refrigerant jacket. |
地址 |
Osaka-shi, Osaka JP |