发明名称 Adhesive composition, varnish, adhesive film and wiring film
摘要 Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
申请公布号 US9028970(B2) 申请公布日期 2015.05.12
申请号 US201313771949 申请日期 2013.02.20
申请人 Hitachi Metals, Ltd. 发明人 Amou Satoru;Abe Tomiya;Shanai Daisuke;Komatsu Hiroaki;Murakami Kenichi
分类号 B32B27/08;B32B27/18;B32B27/26;B32B27/28;C09J163/00;C09J171/10;C09J171/00;H05K1/03;C09J181/06;B32B27/38;H05K3/38;B32B7/12;B32B3/08 主分类号 B32B27/08
代理机构 Crowell & Moring LLP 代理人 Crowell & Moring LLP
主权项 1. An adhesive composition comprising: 100 parts by weight of a phenoxy resin (A) having a plurality of alcoholic hydroxyl groups on the side chain thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having one isocyanate group and at least one functional group of a vinyl group, an acrylate group and a methacrylate group in the molecule thereof; 5 to 30 parts by weight of a maleimide compound (C) having a plurality of maleimide groups in the molecule thereof or/and a reaction product thereof, 0.001 to 0.1 part by weight of an urethanation catalyst (E), 0.0002 to 1 part by weight of a radical polymerization inhibitor (F), and 0.03 to 1 part by weight of a radical polymerization initiator (G) which has a 1-hour half life temperature of from 120° C. to 180° C., wherein a total amount of the component (B) and the component (C) is from 7 to 60 parts by weight.
地址 Tokyo JP