发明名称 Optical sensor device
摘要 An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.
申请公布号 US9029968(B2) 申请公布日期 2015.05.12
申请号 US201213676404 申请日期 2012.11.14
申请人 Seiko Instruments Inc. 发明人 Tsukagoshi Koji;Kamamori Hitoshi;Oku Sadao;Fujita Hiroyuki;Hayashi Keiichiro
分类号 H01L31/0232;G01J1/44;G01J1/02;G01J1/42 主分类号 H01L31/0232
代理机构 Adams & Wilks 代理人 Adams & Wilks
主权项 1. An optical sensor device, comprising: a glass lid substrate; an optical sensor element electrically connected to a wiring pattern provided by metalization on the glass lid substrate; and a glass substrate with a cavity bonded to the glass lid substrate, wherein: the glass lid substrate is made entirely of glass having a light shielding property and has an opening therethrough filled with a glass having a filter function of filtering out a predetermined wavelength of radiation; the glass substrate with the cavity includes therein a through-hole filled with metal to form a through-electrode; the glass substrate with the cavity includes wiring patterns provided by metalization on a side of a surface having the cavity and on an opposite surface side, respectively; the wiring patterns and the through-electrode are structurally integral with each other; the wiring pattern on the glass lid substrate and the wiring pattern on the side of the surface having the cavity on the glass substrate with the cavity are electrically connected to each other with an adhesive having conductive particles added thereto; and the glass lid substrate and the glass substrate with the cavity are fixed and bonded together.
地址 JP