发明名称 |
INSPECTION APPARATUS, INSPECTION SYSTEM, INSPECTION METHOD OF SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD OF INSPECTED SEMICONDUCTOR DEVICES |
摘要 |
An inspection apparatus for inspecting output signal of a semiconductor device is provided with a monitor device configured to sense a signal on the monitor line and a plurality of inspection circuits connected to the monitor line. Each inspection circuit is provided with a semiconductor device support allowing a semiconductor device to be set thereon and including a signal terminal to which a signal is input from the set semiconductor device, a first resistor connected between the signal terminal and the monitor line, a selector terminal, and a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side. |
申请公布号 |
US2015123694(A1) |
申请公布日期 |
2015.05.07 |
申请号 |
US201214402951 |
申请日期 |
2012.07.18 |
申请人 |
Osanai Yosuke;Ushijima Takashi |
发明人 |
Osanai Yosuke;Ushijima Takashi |
分类号 |
H01L21/66;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
1. An inspection apparatus configured to inspect output signal of semiconductor devices, the inspection apparatus comprising:
a monitor line, a monitor device configured to sense a signal on the monitor line; and a plurality of inspection circuits connected to the monitor line, wherein each inspection circuit comprises: a semiconductor device support on which a semiconductor device is to be set, the semiconductor device support comprising a signal terminal to which a signal is input from the semiconductor device set on the semiconductor support; a first resistor connected between the signal terminal and the monitor line; a selector terminal; and a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side. |
地址 |
Toyota-shi JP |