发明名称 めっき装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a plating device which uses a plating tank horizontally rotatable with a vertical shaft, and has improved plating efficiency thereby forming a uniform plating layer on a plurality of objects to be plated. <P>SOLUTION: The plating device has an inner circumferential part of the plating tank 2 horizontally rotatable with the vertical shaft 1, the inner circumferential part includes: a first inclination part 2b which is connected to a disk-like bottom part 2a and continues so as to extend the bottom part 2a; a cylinder part 2c which is connected to the first inclination part 2b; and a second inclination part 2d which is connected to the cylinder part 2c and continues so as to contract the cylinder part 2c, wherein a cathode is arranged on at least a part of the cylinder part 2c. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP5713226(B2) 申请公布日期 2015.05.07
申请号 JP20100043870 申请日期 2010.03.01
申请人 发明人
分类号 C25D17/00;C25D17/22 主分类号 C25D17/00
代理机构 代理人
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