发明名称 |
TREATMENT FOR FLOWABLE DIELECTRIC DEPOSITION ON SUBSTRATE SURFACES |
摘要 |
Provided herein are methods and apparatus for improved flowable dielectric deposition on substrate surfaces. The methods involve improving nucleation and wetting on the substrate surface without forming a thick high wet etch rate interface layer. According to various embodiments, the methods may include single or multi-stage remote plasma treatments of a deposition surface. In some embodiments, a treatment may include exposure to both a reducing chemistry and a hydrogen-containing oxidizing chemistry. Apparatus for performing the methods are also provided. |
申请公布号 |
KR20150048084(A) |
申请公布日期 |
2015.05.06 |
申请号 |
KR20140146464 |
申请日期 |
2014.10.27 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
REILLY PATRICK;TE NIJENHUIS HARALD;DRAEGER NERISSA SUE;VAN SCHRAVENDIJK BART J.;NDIEGE NICHOLAS MUGA |
分类号 |
H01L21/31;H01L21/02;H01L21/205;H05H1/46 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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