Conductor with sub-lithographic self-aligned 3D confinement

摘要

A three-dimensionally (3d) confined conductor advantageously used as an electronic fuse and self-aligned methods of forming the same. By non-conformal deposition of a dielectric film over raised structures, a 3d confined tube, which may be sub-lithographic, is formed between the raised structures. Etching holes which intersect the 3d confined region and subsequent metal deposition fills the 3d confined region and forms contacts. When the raised structures are gates, the fuse element may be located at the middle of the line (i.e. in pre-metal dielectric). Other methods for creating the structure are also described.

主权项

1. A structure comprising:
a pair of raised structures each having a length wherein the pair of raised structures run parallel to each other for a least a portion of their respective lengths; a spacing separating the pair of raised structures; a dielectric film forming a 3d confined region wherein the 3d confined region is at least partially in the spacing separating the pair of raised structures; a conductor within the 3d confined region; a contact; and an intersection point of the contact and the conductor wherein the intersection point is above a bottom of the contact and below a top of the contact such that the conductor is not co-planar with the bottom of the contact and not co-planar with the top of the contact.