| 摘要 |
Provided is a wiring board by which improvement in dimensional accuracy of a surface electrode layer connected to an external element is achieved. The wiring board (1) is provided with: an insulating layer (2); a base electrode layer (3a) layered on one primary surface of the insulating layer (2) in prescribed regions; an insulating covering layer (4) layered on one primary surface of the insulating layer (2) so as to cover respective portions of edges of the base electrode layer (3a); and a surface electrode layer (5) plated on exposed portions (3a1) of the base electrode layer (3a) not covered by the insulating covering layer (4), the thickness of covered portions (3a2) of the base electrode layer (3a) covered by the insulating covering layer (4) being less than the thickness of the exposed portions (3a1). Such a configuration causes the thickness of the insulating covering layer (4) on the covered portions (3a2) to be thinner by an amount equal to the difference in thickness between the exposed portions (3a1) and the covered portions (3a2) of the base electrode layer (3a), and thus, the surface electrode layer (5) is formed only on the exposed portions (3a1) of the base electrode layer (3a). Thus, it is possible to provide a wiring board by which improvement in dimensional accuracy of the surface electrode layer (5) is achieved. |
