发明名称 |
HIGH THERMAL CONDUCTIVITY/LOW COEFFICIENT OF THERMAL EXPANSION COMPOSITES |
摘要 |
A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material. |
申请公布号 |
EP2686163(A4) |
申请公布日期 |
2015.04.29 |
申请号 |
EP20120757194 |
申请日期 |
2012.03.15 |
申请人 |
MOMENTIVE PERFORMANCE MATERIALS INC. |
发明人 |
FAN, WEI;LIU, XIANG;MARINER, JOHN |
分类号 |
B32B3/26;B32B9/00;B32B15/04;F28F7/00;F28F21/02;H01L23/36;H01L23/373 |
主分类号 |
B32B3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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