发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device manufactured by the same, which can reduce manufacturing cost of a semiconductor device by improving yield of an encapsulation layer.SOLUTION: A manufacturing method of an optical semiconductor device 1 comprises: a preparation process of preparing a plurality of optical semiconductor elements 3 which are mounted on a substrate 2 and arranged at a distance from each other in a horizontal direction; and an encapsulation process of encapsulating the plurality of optical semiconductor elements 3 in a manner such that a plurality of encapsulation layers 5 containing grains are arranged at a distance from each other in the horizontal direction correspondingly to respective optical semiconductor elements 3 one-on-one. |
申请公布号 |
JP2015082580(A) |
申请公布日期 |
2015.04.27 |
申请号 |
JP20130219877 |
申请日期 |
2013.10.23 |
申请人 |
NITTO DENKO CORP |
发明人 |
OYABU KYOYA;NINOMIYA AKIHITO |
分类号 |
H01L33/52;H01L23/29;H01L23/31 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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