发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device manufactured by the same, which can reduce manufacturing cost of a semiconductor device by improving yield of an encapsulation layer.SOLUTION: A manufacturing method of an optical semiconductor device 1 comprises: a preparation process of preparing a plurality of optical semiconductor elements 3 which are mounted on a substrate 2 and arranged at a distance from each other in a horizontal direction; and an encapsulation process of encapsulating the plurality of optical semiconductor elements 3 in a manner such that a plurality of encapsulation layers 5 containing grains are arranged at a distance from each other in the horizontal direction correspondingly to respective optical semiconductor elements 3 one-on-one.
申请公布号 JP2015082580(A) 申请公布日期 2015.04.27
申请号 JP20130219877 申请日期 2013.10.23
申请人 NITTO DENKO CORP 发明人 OYABU KYOYA;NINOMIYA AKIHITO
分类号 H01L33/52;H01L23/29;H01L23/31 主分类号 H01L33/52
代理机构 代理人
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