发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
摘要 A semiconductor device has a semiconductor substrate including a cell region and a peripheral region and includes: a Silicon-Metal-Silicon (SMS)-structured wafer formed in the cell region, which includes a stacked structure of a first silicon substrate, a metal layer, and a second silicon substrate; and a Silicon On Insulator (SOI)-structured wafer formed in the peripheral region, which includes a stacked structure of the first silicon substrate, a silicon insulation film, and the second silicon substrate.
申请公布号 US2015108574(A1) 申请公布日期 2015.04.23
申请号 US201414197170 申请日期 2014.03.04
申请人 SK HYNIX INC. 发明人 SUNG Min Chul
分类号 H01L27/12;H01L29/78;H01L27/108 主分类号 H01L27/12
代理机构 代理人
主权项 1. A semiconductor device comprising: a semiconductor substrate including a cell region and a peripheral region; a Silicon-Metal-Silicon (SMS)-structured wafer provided in the cell region and including a stacked structure of a first silicon substrate, a metal layer, and a second silicon substrate; and a Silicon On Insulator (SOI)-structured wafer provided in the peripheral region and including a stacked structure of the first silicon substrate, a first silicon insulation film on an upper surface of the first silicon substrate, the second silicon substrate, and a second silicon insulation film on a lower surface of the second silicon substrate.
地址 Icheon-si KR
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