发明名称 METAL-INSULATOR-METAL CAPACITOR STRUCTURE
摘要 A capacitor structure in a semiconductor device includes a semiconductor substrate having a top surface and a bottom surface opposite the top surface, an isolation region having a top surface and a bottom surface, opposite the top surface, the bottom surface of the isolation region being disposed on the top surface of the semiconductor substrate. The capacitor structure also includes a gate terminal structure disposed on the top surface of the isolation region and a diffusion contact structure disposed on the top surface of the isolation region and arranged parallel to the gate terminal structure. In some aspects, the gate terminal structure is connected to a first contact node and the diffusion contact structure is connected to a second contact node, in which the first and second contact nodes form opposing nodes of the capacitor structure.
申请公布号 US2015108557(A1) 申请公布日期 2015.04.23
申请号 US201314072723 申请日期 2013.11.05
申请人 Broadcom Corporation 发明人 PONOTH Shom Surendran;PARK Changyok;SHIAU Guang-Jye;ITO Akira
分类号 H01L27/08;H01L49/02 主分类号 H01L27/08
代理机构 代理人
主权项 1. A capacitor structure in a semiconductor device, the capacitor structure comprising: a semiconductor substrate having a top surface and a bottom surface opposite the top surface; an isolation region having a top surface and a bottom surface, opposite the top surface, the bottom surface of the isolation region being disposed adjacent to the top surface of the semiconductor substrate; a gate terminal structure disposed on the top surface of the isolation region; and a diffusion contact structure disposed on the top surface of the isolation region and arranged parallel to the gate terminal structure, wherein the gate terminal structure is connected to a first contact node and the diffusion contact structure is connected to a second contact node, wherein the first and second contact nodes form opposing nodes of the capacitor structure.
地址 Irvine CA US