SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent adhesion of an insulating resin layer for filling a gap between a semiconductor chip and a substrate and the like to a holder of a semiconductor chip when the semiconductor chip is mounted on the substrate and the like.SOLUTION: A semiconductor device manufacturing method comprises: a process of preparing a first substrate having a connection pad on a first surface; a process of preparing a second substrate on which bump electrodes are arranged on a second surface and a resin filler is formed on the second surface so as to cover the bump electrodes; a process of selectively applying specific energy to a partial region of the resin filler to form a semi-cured layer; and a process of mounting the second substrate on the first substrate so as to oppose the second surface to the first surface and electrically connecting the bump electrodes to the connection pads and filling a gap between the first substrate and the second substrate with the resin filler.